Movie S2.

An experimental demonstration showing the interfacial debonding process by using a custom-modified peeling apparatus.

Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics

Dae Seung Wie, Yue Zhang, Min Ku Kim, Bongjoong Kim, Sangwook Park, Young-Joon Kim, Pedro P. Irazoqui, Xiaolin Zheng, Baoxing Xu, and Chi Hwan Lee

PNAS. 2018. 115:E7236-E7244 DOI: 10.1073/pnas.1806640115